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I am helping a company which does dip soldering (lead) as part of 
their manufacturing process.  However, a problem arises if too much 
solder remains after the dip, and thus they flick the product (a snap 
of the wrist) after the dip to throw off the excess solder.  Is there 
any other techniques, technologies available to negate this action?  
Currently, plastic tarp surrounds the area and is used to catch the 
excess solder.  We are looking for a "cleaner" process, so as to 
limit the movement of the fresh dipped solder as much as possible.

Ryan Green