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FW: Substitution of non-hazardous alternatives to formaldehyde in electroless copper plating in circuit board manufacturing




P2ies-

any advice or info, sources for Leo on below?

thanks
>  -----Original Message-----
> From: 	Anglero, Leo  
> Sent:	Tuesday, September 17, 2002 3:47 PM
> To:	Valin, Debby; MacCormac, Deborah; Syrdahl, Slade; 'Gonzalez, Raul'
> Cc:	Elliott, Gene; Kane, Phil
> Subject:	Substitution of non-hazardous alternatives to formaldehyde in
> electroless copper plating in circuit board manufacturing
> 
> It is amazing the help that you guys have provided me...  All the
> information received has been very helpful and useful...  I thank you all
> very much...
> 
> I am sorry to keep bothering you all but can anyone refer me to information
> with regards of the following:
> 
>    "Substitution of non-hazardous alternatives to formaldehyde in
> electroless copper plating in circuit board manufacturing."
> 
> Your time, consideration and efforts are greatly appreciated.
> 
> Truly yours,
> 
> Leonardo "Leo" Angleró
> Permitting Engineer III
> phone - 407.893.3315 ext. 2236
> sc - 325.2236
> fax - 407.897.2966
> leo.anglero@dep.state.fl.us
> 
> 

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