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RE: Substitution of non-hazardous alternatives to formaldehyde in electroless copper plating in circuit board manufacturing



Leo,

See the following publications :

[1] Kincaid, L.E.; Giebig, J.R. (1998) Printed Wiring Board Cleaner
Technologies Substitute Assessment: Making Holes Conductive - Volume I.
United States Environmental Protection Agency; Prevention, Pesticides, and
Toxic Substances (EPA 744-R-98-004a), Washington, DC
[2] USEPA (1998) Printed Wiring Board Cleaner Technologies Substitute
Assessment: Making Holes Conductive - Volume 2: Appendices. United States
Environmental Protection Agency; Prevention, Pesticides, and Toxic
Substances (EPA 744-R-98-004b), Washington, DC
[3] Schiller, H.; Gallegos, D.; Pittman, K. (1993) Electroless-Copper
Alternatives - Complying with OSHA's new formaldehyde regulations. Printed
Circuit Fabrication 16(11):46, 48-49

Denis Begin, MSc
Research Assistant
Universite de Montreal
Dept. of Environmental and Occupational Health
PO Box 6128, Main Station
Montreal, Quebec H3C 3J7
Canada
Tel : 514-343-2170
Fax : 514-343-2200
denis.begin@umontreal.ca
http://www.mdtrav.umontreal.ca

> -----Message d'origine-----
> De : owner-p2tech@great-lakes.net
> [mailto:owner-p2tech@great-lakes.net]De la part de Valin, Debby
> Envoyé : 18 septembre, 2002 08:10
> À : P2TechNet (E-mail)
> Cc : Anglero, Leo; Abcarian, Julie; Babb, David; Bodin, Christopher;
> Burns, Richard; Comer, Laura; Gephart, Albert; Graves, Aprilia;
> Humphreys, Charles; Leonard, Brenda; MacCormac, Deborah; Marchant,
> Barry; Ohlsen, Michael; Richards, William R.; Syrdahl, Slade; Thompson,
> Paul; Wielkens, Donatus
> Objet : FW: Substitution of non-hazardous alternatives to formaldehyde
> in electroless copper plating in circuit board manufacturing
>
>
>
> P2ies-
>
> any advice or info, sources for Leo on below?
>
> thanks
> >  -----Original Message-----
> > From: 	Anglero, Leo
> > Sent:	Tuesday, September 17, 2002 3:47 PM
> > To:	Valin, Debby; MacCormac, Deborah; Syrdahl, Slade; 'Gonzalez, Raul'
> > Cc:	Elliott, Gene; Kane, Phil
> > Subject:	Substitution of non-hazardous alternatives to
> formaldehyde in
> > electroless copper plating in circuit board manufacturing
> >
> > It is amazing the help that you guys have provided me...  All the
> > information received has been very helpful and useful...  I
> thank you all
> > very much...
> >
> > I am sorry to keep bothering you all but can anyone refer me to
> information
> > with regards of the following:
> >
> >    "Substitution of non-hazardous alternatives to formaldehyde in
> > electroless copper plating in circuit board manufacturing."
> >
> > Your time, consideration and efforts are greatly appreciated.
> >
> > Truly yours,
> >
> > Leonardo "Leo" Angleró
> > Permitting Engineer III
> > phone - 407.893.3315 ext. 2236
> > sc - 325.2236
> > fax - 407.897.2966
> > leo.anglero@dep.state.fl.us
> >
> >
>
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