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Call for Papers, International Conference on Environmentally Conscious Manufacturing IV in Philadelphia



Call for Papers

(Part of SPIE's International Symposium on Optics East)

October 25-28, 2004
Pennsylvania Convention Center, Philadelphia, PA, USA

Conference Chair
Surendra M. Gupta,
Northeastern University (USA), e-mail: gupta@neu.edu

Program Committee
Belarmino Adenso-Diaz
, Univ. de Oviedo (Spain);
Hans-Dietrich Haasis, Institut für Seeverkehrswirtschaft und Logistik (Germany);
Karl Inderfurth, Otto-von-Guericke-Univ. Magdeburg (Germany);
N. Elif Kongar, Yildiz Technical Univ. (Turkey);
Aybek Korugan, Bogazici Univ. (Turkey);
A. J. D. Lambert, Technische Univ. Eindhoven (Netherlands);
Kenichi Nakashima, Osaka Institute of Technology (Japan);
Joseph Sarkis, Clark Univ.;
Thomas Spengler, Technische Univ. Braunschweig (Germany);
Pitipong Veerakamolmal, IBM Corp.

Environmentally Conscious Manufacturing (ECM) is concerned with developing methods for manufacturing new products from conceptual design to final delivery and ultimately to the end-of-life disposal such that all the environmental standards and requirements are satisfied. Industrialized countries all over the world are facing serious aftermath of the rapid development that has taken place in the last few decades.

In recent years, environmental awareness and recycling regulations have been putting pressure on many manufacturers and consumers, forcing them to produce and dispose of products in an environmentally responsible manner. Government regulations are becoming more compelling as many manufacturers feel the pressure to use recycled materials whenever possible. Sometimes they are even required to take care of their products at the end of their useful lives. This has created a need to design products that are friendly towards the environment, and easy to disassemble and recycle. To that end, there is a need to develop algorithms, models, heuristics and software for addressing recycling and other end-of-life issues (such as the economic viability and the logistic aspects of disassembly, recycling, and remanufacturing) for an ever-increasing number of discarded products.

This conference will provide a forum for the latest developments in the field of environmentally conscious manufacturing (ECM) such as product reuse, remanufacturing, disassembly, and recycling strategies in a focused manner. Potential topics to be addressed in this conference include, but are not limited to, the following:

* algorithms and heuristics in ECM
* case studies in ECM
* closed-loop supply chain
* design for disassembly
* design for environment
* design for recycling
* design for remanufacturing
* disassembly process planning
* disassembly scheduling
* disposition and waste management
* ECM design of product and processes
* economic aspects of ECM
* end-of-life management and recovery
* environmental impact assessment models
* environmentally benign packaging
* integrated disassembly line
* life cycle assessment of ECM
* logistic aspects of ECM
* OR models in ECM
* product reuse
* product recovery
* recycling process planning
* remanufacturing process planning
* remanufacturing and inventory issues
* return flows in the supply chain
* reverse logistics
* sustainable products.

(Proceedings of this conference will be published)

Important Dates

for this conference are due by April 12, 2004
(contact the chair before the deadline if you need more time).

Manuscripts are due by September 27, 2004.

Submission of Abstracts

All authors are STRONGLY ENCOURAGED to submit their abstracts by the due date using the "Submit an Abstract for this Conference" link on the Web at:


Using this method of submission ensures that your abstract will be immediately accessible to the conference chair for review. Using other methods of submission (listed below) will delay the processing of your abstract.

You will be asked to provide information about the paper that you are submitting, including all authors' contact information and a summary of the paper. You will also be asked who should be contacted about this submission. Please note! The contact author must also submit the manuscript and all revisions.

If it is your first time to MySPIE, SPIE's author/chair website, you will need to create an account. To create a new account, click on the create an account link.

If WWW access is not available, please E-MAIL each abstract separately to: abstracts@spie.org in ASCII text (not encoded) format. Abstracts submitted via e-mail will not be immediately processed for chair review; there will be a time delay. *

IMPORTANT: to ensure receipt and proper processing of your abstract, the Subject line must include only the following:


Your abstract submission MUST include ALL of the following:


2. AUTHOR LISTING (Principal author first)
        For each author: First name (initials not acceptable), Last name,
        Affiliation, Mailing address, Telephone, Fax, and Email address.

        Write "Oral Presentation".

4. BRIEF BIOGRAPHY (Principal/presenting author)
        Approximately 50 words.

        Approximately 250 words.

        List a maximum of five keywords.

Further Information on the web

Download a pdf version of the Call for Papers:

Download a pdf version of the Table of Contents for the 2000 Conference Proceedings:

Download a pdf version of the Table of Contents for the 2001 Conference Proceedings:

Download a pdf version of the Table of Contents for the 2003 Conference Proceedings:

Download sample papers from the 2000 Conference:

PHILADELPHIA links on the web

The official site of the City of Philadelphia

Philadelphia Tourism

Dr. Surendra M. Gupta, P.E.
Professor of Mechanical, Industrial and Manufacturing Engineering and
Director of Laboratory for Responsible Manufacturing
334 SN, Department of MIME
Northeastern University
360 Huntington Avenue
Boston, MA 02115, U.S.A.

Phone: (617)-373-4846
Fax:      (617)-373-2921
E-mail: gupta@neu.edu

Home Page: http://www.coe.neu.edu/~smgupta/