FOR ANY CROSS POSTINGS
ENVIRONMENTALLY CONSCIOUS MANUFACTURING IV (OE119)
(Part of SPIE's
International Symposium on Optics East)
October 25-28, 2004
Pennsylvania Convention Center, Philadelphia, PA, USA
Surendra M. Gupta, Northeastern
University (USA), e-mail: firstname.lastname@example.org
Belarmino Adenso-Diaz, Univ. de Oviedo (Spain);
Hans-Dietrich Haasis, Institut für
Seeverkehrswirtschaft und Logistik (Germany);
Otto-von-Guericke-Univ. Magdeburg (Germany);
N. Elif Kongar, Yildiz Technical
Aybek Korugan, Bogazici Univ.
A. J. D. Lambert, Technische Univ.
Kenichi Nakashima, Osaka Institute
of Technology (Japan);
Joseph Sarkis, Clark Univ.;
Thomas Spengler, Technische Univ.
Pitipong Veerakamolmal, IBM Corp.
Environmentally Conscious Manufacturing (ECM) is concerned with developing
methods for manufacturing new products from conceptual design to final delivery
and ultimately to the end-of-life disposal such that all the environmental
standards and requirements are satisfied. Industrialized countries all over the
world are facing serious aftermath of the rapid development that has taken
place in the last few decades.
In recent years, environmental awareness and recycling regulations have been
putting pressure on many manufacturers and consumers, forcing them to produce
and dispose of products in an environmentally responsible manner. Government
regulations are becoming more compelling as many manufacturers feel the
pressure to use recycled materials whenever possible. Sometimes they are even
required to take care of their products at the end of their useful lives. This
has created a need to design products that are friendly towards the
environment, and easy to disassemble and recycle. To that end, there is a need
to develop algorithms, models, heuristics and software for addressing recycling
and other end-of-life issues (such as the economic viability and the logistic
aspects of disassembly, recycling, and remanufacturing) for an ever-increasing
number of discarded products.
This conference will provide a forum for the latest developments in the field
of environmentally conscious manufacturing (ECM) such as product reuse,
remanufacturing, disassembly, and recycling strategies in a focused manner.
Potential topics to be addressed in this conference include, but are not
limited to, the following:
* algorithms and heuristics in ECM
* case studies in ECM
* closed-loop supply chain
* design for disassembly
* design for environment
* design for recycling
* design for remanufacturing
* disassembly process planning
* disassembly scheduling
* disposition and waste management
* ECM design of product and processes
* economic aspects of ECM
* end-of-life management and recovery
* environmental impact assessment models
* environmentally benign packaging
* integrated disassembly line
* life cycle assessment of ECM
* logistic aspects of ECM
* OR models in ECM
* product reuse
* product recovery
* recycling process planning
* remanufacturing process planning
* remanufacturing and inventory issues
* return flows in the supply chain
* reverse logistics
* sustainable products.
(Proceedings of this conference will be published)
for this conference are due by April 12, 2004
(contact the chair before the deadline if you need more time).
are due by September 27, 2004.
All authors are STRONGLY ENCOURAGED to submit their
abstracts by the due date using the "Submit an Abstract for this
Conference" link on the Web at:
Using this method of submission ensures that your abstract will be immediately
accessible to the conference chair for review. Using other methods of
submission (listed below) will delay the processing of your abstract.
You will be asked to provide information about the paper that you are
submitting, including all authors' contact information and a summary of
the paper. You will also be asked who should be contacted about this
submission. Please note! The contact author must also submit the manuscript and
If it is your first time to MySPIE, SPIE's author/chair website, you will
need to create an account. To create a new account, click on the create an
If WWW access is not available, please E-MAIL each abstract separately to:
email@example.com in ASCII text (not encoded) format. Abstracts submitted via
e-mail will not be immediately processed for chair review; there will be a time
IMPORTANT: to ensure receipt and proper processing of your abstract, the
Subject line must include only the following:
SUBJECT: OE119, GUPTA
Your abstract submission MUST include ALL of the following:
1. PAPER TITLE
2. AUTHOR LISTING
(Principal author first)
For each author:
First name (initials not acceptable), Last name,
Mailing address, Telephone, Fax, and Email address.
4. BRIEF BIOGRAPHY
5. ABSTRACT TEXT
a maximum of five keywords.
Information on the web
Download a pdf version of the Call for Papers:
Download a pdf version of the Table of Contents for the 2000 Conference
Download a pdf version of the Table of Contents for the 2001 Conference
Download a pdf version of the Table of Contents for the 2003 Conference
Download sample papers from the 2000 Conference:
PHILADELPHIA links on the web
The official site of the City of Philadelphia
Dr. Surendra M. Gupta, P.E.
Professor of Mechanical, Industrial and Manufacturing Engineering and
Director of Laboratory for Responsible Manufacturing
334 SN, Department of MIME
360 Huntington Avenue
Boston, MA 02115, U.S.A.
Home Page: http://www.coe.neu.edu/~smgupta/